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  BB101M build in biasing circuit mos fet ic uhf rf amplifier ade-208-504 1st. edition features build in biasing circuit; to reduce using parts cost & pc board space. low noise characteristics; (nf = 2.0 db typ. at f = 900 mhz) withstanding to esd; build in esd absorbing diode. withstand up to 200 v at c = 200 pf, rs = 0 conditions. outline 1. source 2. gate1 3. gate2 4. drain mpak-4 1 4 3 2
BB101M 2 absolute maximum ratings (ta = 25?) item symbol ratings unit drain to source voltage v ds 6v gate 1 to source voltage v g1s +6 ? v gate 2 to source voltage v g2s 6v drain current i d 25 ma channel power dissipation pch 150 mw channel temperature tch 150 c storage temperature tstg ?5 to +150 c
BB101M 3 electrical characteristics (ta = 25?) item symbol min typ max unit test conditions drain to source breakdown voltage v (br)dss 6vi d = 200 m a v g1s = v g2s = 0 gate 1 to source breakdown voltage v (br)g1ss +6 v i g1 = +10 m a v g2s = v ds = 0 gate 2 to source breakdown voltage v (br)g2ss 6 v i g2 = 10 m a v g1s = v ds = 0 gate 1 to source cutoff current i g1ss +100 na v g1s = +5 v v g2s = v ds = 0 gate 2 to source cutoff current i g2ss 100 na v g2s = 5 v v g1s = v ds = 0 gate 1 to source cutoff voltage v g1s(off) 0.2 0.8 v v ds = 5 v, v g2s = 4 v i d = 100 m a gate 2 to source cutoff voltage v g2s(off) 0.4 1.0 v v ds = 5 v, v g1s = 5 v i d = 100 m a drain current i d(op) 10 15 20 ma v ds = 5 v, v g1 = 5 v v g2s = 4 v, r g = 220 k w forward transfer admittance |y fs | 16 22 ms v ds = 5 v, v g1 = 5 v, v g2s = 4 v, r g = 220 k w , f = 1 khz input capacitance ciss 1.2 1.7 2.2 pf v ds = 5 v, v g1 = 5 v output capacitance coss 0.7 1.1 1.5 pf v g2s = 4 v, r g = 220 k w reverse transfer capacitance crss 0.012 0.03 pf f = 1 mhz power gain pg 16 20 db v ds = 5 v, v g1 = 5 v v g2s = 4 v noise figure nf 2.0 3.0 db r g = 220 k w , f = 900 mhz note: marking is ?u.
BB101M 4 main characteristics test circuit for operating items (i , |yfs|, ciss, coss, crss, nf, pg) application circuit d(op) gate 1 source drain gate 2 r g a i d v g2 v g1 output input v = 4 to 0.3 v agc v = 5 v ds r g v = 5 v gg bbfet
BB101M 5 200 150 100 50 0 50 100 150 200 channel power dissipation pch (mw) ambient temperature ta ( c) maximum channel power dissipation curve 25 20 15 10 5 0 1 2345 100 k w 120 k w 150 k w 180 k w 220 k w 270 k w 330 k w 390 k w r g = 470 k w drain to source voltage v ds (v) drain current i d (ma) typical output characteristics v g2s = 4 v v g1 = v ds 25 20 15 10 5 0 1 2345 gate2 to source voltage v g2s (v) drain current i d (ma) drain current vs. gate2 to source voltage v ds = v g1 = 5 v 150 k w 180 k w 220 k w 270 k w r = 470 k w g 120 k w 100 k w 330 k w 390 k w 20 16 12 8 4 0 12345 v g2s = 1 v v ds = 5 v r g = 150 k w 4 v 3 v 2 v gate1 voltage v g1 (v) drain current i d (ma) drain current vs. gate1 voltage
BB101M 6 20 16 12 8 4 0 1 2345 gate1 voltage v g1 (v) drain current i d (ma) v g2s = 1 v 4 v 3 v 2 v v ds = 5 v r g = 220 k w drain current vs.gate1 voltege 20 16 12 8 4 0 1 2345 4 v 3 v 2 v v g2s = 1 v v ds = 5 v r g = 390 k w gate1 voltage v g1 (v) drain current i d (ma) drain current vs.gate1 voltege 25 20 15 10 5 0 1 2345 forward transfer admittance |y | (ms) fs forward transfer admittance vs. gate1 voltage gate1 voltage v g1 (v) v g2s = 1 v 4 v 3 v 2 v v ds = 5 v r g = 150 k w f = 1 khz 25 20 15 10 5 0 12345 forward transfer admittance |y | (ms) fs 4 v 3 v 2 v v g2s = 1 v v ds = 5 v r g = 220 k w f = 1 khz forward transfer admittance vs. gate1 voltage gate1 voltage v g1 (v)
BB101M 7 25 20 15 10 5 0 1 2345 forward transfer admittance |y | (ms) fs forward transfer admittance vs. gate1 voltage gate1 voltage v g1 (v) v g2s = 1 v 4 v 3 v 2 v v ds = 5 v r g = 390 k w f = 1 khz power gain vs. gate resistance 30 25 20 15 10 5 0 50 100 200 500 1000 2000 5000 gate resistance r g (k w ) power gain pg (db) v ds = 5 v v g1 = 5 v v g2s = 4 v f = 900 mhz noise figure vs. gate resistance 0 50 100 200 500 1000 2000 5000 gate resistance r g (k w ) noise figure nf (db) 4 3 2 1 v ds = 5 v v g1 = 5 v v g2s = 4 v f = 900 mhz 30 25 20 15 10 5 0 power gain pg (db) power gain vs. drain current drain current i d (ma) 510152025 30 v ds = 5 v v g1 = 5 v v g2s = 4 v r g = variable f = 900 mhz
BB101M 8 0 noise figure nf (db) noise figure vs. drain current drain current i d (ma) 510152025 30 4 3 2 1 v ds = 5 v v g1 = 5 v v g2s = 4 v r g = variable f = 900 mhz 30 25 20 15 10 5 0 drain current i d (ma) drain current vs. gate resistance gate resistance r g (k w ) 10 30 100 300 1000 3000 10000 v ds = 5 v v g1 = 5 v v g2s = 4 v 40 30 20 10 0 gain reduction gr (db) gain reduction vs. gate2 to source voltage gate2 to source voltage v g2s (v) 1234 5 v = 5 v v = 5 v v = 4 v r = 220 k f = 900 mhz ds g1 g2s g w 4 3 2 1 0 input capacitance ciss (pf) input capacitance vs. gate2 to source voltage gate2 to source voltage v g2s (v) 1234 5 v = 5 v v = 5 v r = 220 k f = 1 mhz ds g1 g w
BB101M 9 4 3 2 1 0 output capacitance coss (pf) output capacitance vs. gate2 to source voltage gate2 to source voltage v g2s (v) 1234 5 v ds = 5 v v g1 = 5 v r g = 220 k f = 1 mhz w
BB101M 10 package dimentions unit: mm 0.16 0 ~ 0.1 0.3 + 0.1 ?0.06 0.95 0.85 1.8 0.65 + 0.1 ?0.3 1.5 0.65 + 0.1 ?0.3 1.1 + 0.2 ?0.1 0.95 0.95 1.9 2.8 + 0.3 ?0.1 0.4 + 0.1 ?0.05 0.4 + 0.1 ?0.05 0.6 + 0.1 ?0.05 0.4 + 0.1 ?0.05 2.8 + 0.2 ?0.6 3 2 4 1 hitachi code eiaj jedec mpak? sc?1aa
cautions 1. hitachi neither warrants nor grants licenses of any rights of hitachi? or any third party? patent, copyright, trademark, or other intellectual property rights for information contained in this document. hitachi bears no responsibility for problems that may arise with third party? rights, including intellectual property rights, in connection with use of the information contained in this document. 2. products and product specifications may be subject to change without notice. confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. hitachi makes every attempt to ensure that its products are of high quality and reliability. however, contact hitachi? sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. design your application so that the product is used within the ranges guaranteed by hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the hitachi product. 5. this product is not designed to be radiation resistant. 6. no one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from hitachi. 7. contact hitachi? sales office for any questions regarding this document or hitachi semiconductor products. hitachi, ltd. semiconductor & integrated circuits. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan tel: tokyo (03) 3270-2111 fax: (03) 3270-5109 copyright ? hitachi, ltd., 1999. all rights reserved. printed in japan. hitachi asia pte. ltd. 16 collyer quay #20-00 hitachi tower singapore 049318 tel: 535-2100 fax: 535-1533 url northamerica : http:semiconductor.hitachi.com/ europe : http://www.hitachi-eu.com/hel/ecg asia (singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm asia (taiwan) : http://www.hitachi.com.tw/e/product/sicd_frame.htm asia (hongkong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm japan : http://www.hitachi.co.jp/sicd/indx.htm hitachi asia ltd. taipei branch office 3f, hung kuo building. no.167, tun-hwa north road, taipei (105) tel: <886> (2) 2718-3666 fax: <886> (2) 2718-8180 hitachi asia (hong kong) ltd. group iii (electronic components) 7/f., north tower, world finance centre, harbour city, canton road, tsim sha tsui, kowloon, hong kong tel: <852> (2) 735 9218 fax: <852> (2) 730 0281 telex: 40815 hitec hx hitachi europe ltd. electronic components group. whitebrook park lower cookham road maidenhead berkshire sl6 8ya, united kingdom tel: <44> (1628) 585000 fax: <44> (1628) 778322 hitachi europe gmbh electronic components group dornacher strae 3 d-85622 feldkirchen, munich germany tel: <49> (89) 9 9180-0 fax: <49> (89) 9 29 30 00 hitachi semiconductor (america) inc. 179 east tasman drive, san jose,ca 95134 tel: <1> (408) 433-1990 fax: <1>(408) 433-0223 for further information write to:


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